Return-loss minimization of package interconnects through input space mapping using FEM-based models
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Fecha
2013-08
Autores
Cervantes-González, Juan C.
López, Carlos A.
Rayas-Sánchez, José E.
Brito-Brito, Zabdiel
Hernández-Sosa, Gaudencio
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Editor
SBMO/IEEE MTT-S International Microwave Optoelectronics Conference (IMOC-2013)
Resumen
Descripción
Highly efficient CAD methodologies based on full-wave EM analysis, for the design of package interconnects are necessary due to the increased frequencies of operation and a desire of faster time-to-market. In this work, we exploit a Broyden-based input space mapping (SM) algorithm with both fine and coarse models implemented with the finite-element method (FEM), to efficiently optimize design parameters of a modern package interconnect. This optimization algorithm has been applied to a single-ended package line resulting in a significant decrease of the return loss in the 5-10 GHz range, requiring just a few fine model evaluations.
Palabras clave
Space Mapping, Package Interconnects, EM-based Design Optimization, High-speed, Return-loss, FEM Space Mapping
Citación
Cervantes-González, J.C.; López, C.A.; Rayas-Sánchez, J.E.; Brito-Brito, Z, and Hernández-Sosa, G. (2013). “Return-loss minimization of package interconnects through input space mapping using FEM-based models,” in Proc. SBMO/IEEE MTT-S Int. Microwave Optoelectronics Conf. (IMOC-2013), Rio de Janeiro, Brazil, Aug. 2013, pp. 1-4.