Impact of 3D EM model configuration on the direct optimization of microstrip structures

dc.contributor.authorBrito-Brito, Zabdiel
dc.contributor.authorRayas-Sánchez, José E.
dc.contributor.authorCervantes-González, Juan C.
dc.contributor.authorLópez, Carlos A.
dc.date.accessioned2016-01-12T17:45:21Z
dc.date.available2016-01-12T17:45:21Z
dc.date.issued2013-10
dc.descriptionWe apply the classical Nelder-Mead optimization algorithm to a low fidelity EM model, using different mesh and bounding-box configurations. We demonstrate that the interaction of the coarse mesh with the bounding box size can determine whether the optimization is successful or not.es
dc.description.sponsorshipITESO, A.C.es
dc.description.sponsorshipIntel Labses
dc.identifier.citationBrito-Brito, Z.; Rayas-Sánchez, J.E.; Cervantes-González, J.C. and López, C.A. (2013) “Impact of 3D EM model configuration on the direct optimization of microstrip structures,” in COMSOL Conf., Boston, MA, Oct. 2013, pp.1-5.es
dc.identifier.otherDOI: 10.13140/RG.2.1.3889.8641
dc.identifier.urihttp://hdl.handle.net/11117/2784
dc.language.isoenges
dc.publisherCOMSOLes
dc.relation.ispartofseriesCOMSOL Conference;2013
dc.rights.urihttp://quijote.biblio.iteso.mx/licencias/CC-BY-NC-ND-2.5-MX.pdfes
dc.subjectMicrostripes
dc.subjectModel Configurationes
dc.subjectEM Simulationes
dc.subjectDirect Optimizationes
dc.titleImpact of 3D EM model configuration on the direct optimization of microstrip structureses
dc.typeinfo:eu-repo/semantics/conferencePaperes
rei.peerreviewedYeses
rei.revisorCOMSOL 2013

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