Optimizing the Full Mixed-Mode Performance of a Differential Microstrip Interconnect with a Right-Angle Bend by using Two Symmetrical Bumps

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dc.contributor.authorVilla-Loustaunau, Enrique R.
dc.contributor.authorRayas-Sánchez, José E.
dc.contributor.authorLoera-Díaz, Roberto
dc.contributor.authorRangel-Patiño, Francisco
dc.date.accessioned2025-04-09T21:41:48Z
dc.date.available2025-04-09T21:41:48Z
dc.date.issued2025-01
dc.description.abstractDifferential interconnects are widely used for high-speed serial data transmission in modern high-performance computer platforms. Differential signaling handle noise better than single ended signaling. However, physical asymmetries and discontinuities in differential links can cause that a portion of the differential energy is converted into common mode (CM) energy, which is perceived as noise at the receiver. This mode conversion in differential interconnects leads to electromagnetic (EM) interference and EM susceptibility, limiting high data rates. In this paper, a microstrip differential interconnect with a severe discontinuity, a right-angle bend, is optimally compensated by using two rectangular length-match bumps. Our formulation allows the efficient optimization of the full set of mixed-mode (MM) S-parameters of the differential interconnect. It uses a smart combination of pattern search and Nelder-Mead to optimize the MM performance considering several starting points. The interconnect MM performance before and after optimization is shown, confirming a very significant performance improvement.
dc.description.sponsorshipITESO, A.C.es_MX
dc.identifier.citationE. R. Villa-Loustaunau, J. E. Rayas-Sánchez, R. Loera-Díaz, and F. Rangel-Patiño. Optimizing the full mixed-mode performance of a differential microstrip interconnect with a right-angle bend by using two symmetrical bumps, in IEEE MTT-S Latin America Microwave Conf. (LAMC-2025), San Juan, Puerto Rico, Jan. 2025, pp. 97-100.
dc.identifier.isbn979-8-3315-4041-8
dc.identifier.urihttps://hdl.handle.net/11117/11498
dc.language.isoeng
dc.publisherIEEE
dc.relation.ispartofseriesIEEE MTT-S Latin America Microwave Conference (LAMC-2025)
dc.rights.urihttps://creativecommons.org/licenses/by-nc-nd/4.0/deed.es
dc.subjectNelder-Mead
dc.subjectPCB
dc.subjectCommon Mode
dc.subjectDifferential Pair
dc.subjectDiscontinuity
dc.subjectHigh-spedd Interconnect
dc.subjectLenght Match Bump
dc.subjectMixed-mode S-parameters
dc.subjectMode Conversion
dc.subjectNoise
dc.subjectOptimization
dc.subjectPattern Search
dc.subjectSymmetry
dc.titleOptimizing the Full Mixed-Mode Performance of a Differential Microstrip Interconnect with a Right-Angle Bend by using Two Symmetrical Bumps
dc.typeinfo:eu-repo/semantics/article
dc.type.versioninfo:eu-repo/semantics/publishedVersion

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