Temperature Effects in Automotive-Grade High Speed Interconnects

dc.contributor.authorDel-Rey, Juan R.
dc.contributor.authorBrito-Brito, Zabdiel
dc.contributor.authorRayas-Sánchez, José E.
dc.contributor.authorIzquierdo, Nicolás
dc.date.accessioned2019-07-23T16:15:45Z
dc.date.issued2016-12
dc.descriptionThis work discerns the frequency response (up to 15 GHz) of several automotive-grade microstrip transmission line structures over a temperature span from -40 to 105 Celsius degrees. To ensure precise measurements, S-parameter responses from several test PCBs based on Cu over FR4 substrate are attained through a vector network analyzer in a controlled environment. Results show that temperature has a major impact on these high speed interconnects in frequencies above a few GHz, setting the need of employing accurate multi-physical models.es
dc.identifier.citationJ. R. Del-Rey, Z. Brito-Brito, J. E. Rayas-Sánchez, and N. Izquierdo, “Temperature effects in automotive-grade high speed interconnects,” in IEEE MTT-S Latin America Microwave Conf. (LAMC-2016), Puerto Vallarta, Mexico, Dec. 2016, pp. 1-4. DOI: 10.1109/LAMC.2016.7851273.es
dc.identifier.isbn978-1-5090-4288-3
dc.identifier.urihttp://hdl.handle.net/11117/5946
dc.language.isoenges
dc.publisherIEEEes
dc.rights.urihttp://quijote.biblio.iteso.mx/licencias/TodosLosDerechosReservados.pdfes
dc.subjectAutomotive Boardses
dc.subjectHigh-speed Interconnectses
dc.subjectTemperature Effectses
dc.titleTemperature Effects in Automotive-Grade High Speed Interconnectses
dc.typeinfo:eu-repo/semantics/conferencePaperes
rei.embargo.lift10000-01-01
rei.embargo.termssiemprees
rei.peerreviewedYeses
rei.revisorRayas-Sánchez, José Ernesto

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