Enhanced procedure to setup the simulation bounding box and the meshing scheme of a 3D finite element EM simulator for planar microwave structures

dc.contributor.authorBrito-Brito, Zabdiel
dc.contributor.authorRayas-Sánchez, José E.
dc.contributor.authorChávez-Hurtado, José L.
dc.date.accessioned2017-05-11T16:37:55Z
dc.date.issued2015-05
dc.descriptionWe present an enhanced procedure to properly configure the simulation bounding box and discretization meshing scheme of a 3-D finite element full-wave EM simulator as applied to planar microwave circuits. Our procedure utilizes a meshing scheme that takes into account not only the wavelength at the highest simulated frequency, but also the geometrical objects associated to the simulated structure, as well as the expected physics behavior. We demonstrate how our physics-based meshing significantly improves the expected EM behavior of planar structures and decreases their sensitivity to the simulation bounding box, with respect to the conventional meshing scheme based on volumetric domains. We also show how a reasonable but inadequate meshing reduces the possibility of success when using direct optimization on the planar structure and makes the optimization process computationally more expensive. Our procedure is illustrated by a fifth order bandstop microstrip filter with L-shaped resonators simulated with COMSOL.es
dc.description.sponsorshipITESO, A.C.es
dc.identifier.citationJ.L. Chávez-Hurtado, Z. Brito-Brito and J. E. Rayas-Sánchez, “Enhanced procedure to setup the simulation bounding box and the meshing scheme of a 3D finite element EM simulator for planar microwave structures,” in IEEE MTT-S Int. Microwave Symp. Dig., Phoenix, AZ, May 2015, pp. 1-3. (ISBN: 978-1-4799-8274-5, INSPEC: 15326132, DOI: 10.1109/MWSYM.2015.7166960).es
dc.identifier.isbn978-1-4799-8274-5
dc.identifier.otherDOI: 10.1109/MWSYM.2015.7166960
dc.identifier.urihttp://hdl.handle.net/11117/4488
dc.language.isoenges
dc.publisherIEEE MTT-S International Microwave Symposium Digestes
dc.relation.ispartofseriesIEEE MTT-S International Microwave Symposium Digest;
dc.rights.urihttp://quijote.biblio.iteso.mx/licencias/CC-BY-NC-2.5-MX.pdfes
dc.subjectEM-based Optimizationes
dc.subjectDiscretizationes
dc.subjectMeshing Schemees
dc.subjectPlanar Structureses
dc.subjectSimulation Bounding Boxes
dc.titleEnhanced procedure to setup the simulation bounding box and the meshing scheme of a 3D finite element EM simulator for planar microwave structureses
dc.typeinfo:eu-repo/semantics/conferencePaperes
rei.embargo.lift10000-01-01
rei.embargo.termssiemprees
rei.peerreviewedYeses
rei.revisorIEEE MTT-S Int. Microwave Symp. Digest

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