An improved EM-based design procedure for single-layer substrate integrated waveguide interconnects with microstrip transitions

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Miniatura

Fecha

2009-02

Autores

Rayas-Sánchez, José E.

Título de la revista

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Título del volumen

Editor

IEEE MTT-S Int. Microwave Workshop Series in Region 9 (IMWS2009-R9) on Signal Integrity and High-Speed Interconnects

Resumen

Descripción

A practical, computationally efficient technique to EM-based design of single-layer SIW interconnects with microstrip transitions is presented in this work. The design technique efficiently exploits a simplified EM model of the SIW interconnect (surrogate model). The initial design of the SIW structure is obtained by using available empirical equations. A low-resolution EM model with solid walls (grooves) is proposed as an efficient SIW surrogate model for direct EM optimization using a few frequency points. The complete EM optimization of the surrogate model consumes much less time (<20%) than just one simulation of the original EM model (with vias) using a high-resolution grid. The proposed practical technique is illustrated by designing a 10-50 GHz SIW interconnect with microstrip transitions on a standard FR4-based substrate.

Palabras clave

Electromagnetic Based Optimization, High-speed Interconnects, Microstrip-to-SIW Transitions, Substrate Integrated Waveguide (SIW)

Citación

J. E. Rayas-Sánchez, “An improved EM-based design procedure for single-layer substrate integrated waveguide interconnects with microstrip transitions,” in IEEE MTT-S Int. Microwave Workshop Series in Region 9 (IMWS2009-R9) on Signal Integrity and High-Speed Interconnects, Guadalajara, Mexico, Feb. 2009, pp. 27-30. (E-ISBN : 978-1-4244-2743-7; P-ISBN: 978-1-4244-2742-0; INSPEC: 10572111; DOI: 10.1109/IMWS.2009.4814902)