Industry-Oriented Research Projects on Computer-Aided Design of High-Frequency Circuits and Systems at ITESO Mexico
Cargando...
Fecha
2018-09
Autores
Rayas-Sánchez, José E.
Rangel-Patiño, Francisco E.
Viveros-Wacher, Andrés
Chávez-Hurtado, José L.
Leal-Romo, Felipe J.
Brito-Brito, Zabdiel
Título de la revista
ISSN de la revista
Título del volumen
Editor
EuMA
Resumen
Descripción
The Mexican Federal Government, through its National Council of Science and Technology (CONACYT, for its initials in Spanish), recently started a new initiative for encouraging the creation of high-quality industry-oriented graduate programs. In line to this initiative, ITESO – the Jesuit University of Guadalajara, Mexico, opened in 2013 an industry-oriented doctoral program in engineering sciences. In this paper, we briefly describe the main research production of this doctoral program in the area of computer-aided design techniques for RF and microwave modeling, design, and optimization of circuits and systems in industrial settings. We summarize the main recent contributions involving surrogate-based modeling and optimization as applied to post-silicon validation of high-speed computer interfaces, signal-integrity testing, power integrity enhancement, and low-cost high-speed interconnect multi-physical characterization. Research contributions validated on realistic industrial platforms in collaboration with high-tech companies are emphasized.
Palabras clave
Artificial Neural Networks (ANN), Equalization, Eye Diagram, High-speed Interconnects, HSIO, Kriging, Neural Network, Optimization, Polynomial, Post-silicon Validation, Power Integrity, SATA, Signal Integrity, Support Vector Machines, Surrogate Models, Temperature Effects, USB
Citación
J. E. Rayas-Sánchez, F. E. Rangel-Patiño, A. Viveros-Wacher, J. L. Chávez-Hurtado, J. R. Del-Rey, F. Leal-Romo, and Z. Brito-Brito, “Industry-oriented research projects on computer-aided design of high-frequency circuits and systems at ITESO Mexico,” in European Microwave Conf. (EuMC-2018), Madrid, Spain, Sep. 2018, pp. 588-591.