Reliable full-wave EM simulation of a single-layer SIW interconnect with transitions to microstrip lines
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Fecha
2014-10
Autores
Rayas-Sánchez, José E.
Chávez-Hurtado, José L.
Brito-Brito, Zabdiel
Título de la revista
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Título del volumen
Editor
COMSOL Conference
Resumen
Descripción
We present a procedure to obtain reliable EM responses for a substrate integrated waveguide (SIW) interconnect with microstrip line transitions. The procedure focuses on two COMSOL configuration settings: meshing sizes and simulation bounding box. Once both are properly configured, the implemented structure is tested by perturbing the simulation bounding box to assure it has no effect on the EM responses
Palabras clave
Simulation Bounding Box, Meshing Scheme, SIW, Microstrip Line, Interconnect, EM Simulation
Citación
Chávez-Hurtado, J.L.; Rayas-Sánchez,E. and Brito-Brito, Z. “Reliable full-wave EM simulation of a single-layer SIW interconnect with transitions to microstrip lines,” in COMSOL Conf., Boston, MA, Oct. 2014, pp. 1-5. (DOI: 10.13140/RG.2.1.2579.1445).